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    3D Integration- A Solution for next Generation Silicon Devices

      Dr. Daniel Shi
     9th-Mar-2009
    Description: 3D integration is another major solution to increase IC density and functionality. Annual growth rate of all the 3D packaging is more than 24%, while the rate of the TSV based 3D packaging is more than 95%. 3D packaging/integration technology is believed to have many applications including consumer electronics, wireless communication, bio-medical devices, aerospace, and automotive, etc. ASTRI has established a comprehensive 3D packaging technology platform for HK/China packaging industry.
    Views: 4113
    Domain: Electronics
    Category: Semiconductors
    Contents:
    1

    3D Integration � A Solution for Next Generation Silicon Devices

    Dr. Daniel SHI Applied Science & Technology Research Institute (ASTRI) Feb. 20, 2009

    ASTRI Proprietary

    Outline
    Background & Motivation Technology Development Status Worldwide Market Development Status & Forecast ASTRI's R&D in 3D Integration
    Package-on-Package (PoP) Through-Silicon-Via (TSV)

    2

    Summary Acknowledgem ... See more