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    3D Testing Challenges to Cost, Profit, Risk

      Gary Fleeman
     Jan 9, 2013
    Description:

    3D Testing Challenges to Cost, Profit, Risk - Getting to Known Good Die (KGD) & Known Good Stack (KGS), Any Multi-die Product Must Consider the Accumulated Yield, Even assuming a perfect interposer, 5 die stack could have 4-5% final yield loss, Conventional Test Holds Many Challenges, Do We Access through TSVs or Test Pads?, If logic is partitioned on different layers, single die may not be fully testable. If Homogeneous memory – treated as multi-bank die.

    Important Tags: 3D Testing Challenges, Known good die, KGD, Known good stack, KGS
    Views: 3722
    Domain: Electronics
    Category: Semiconductors


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