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    3D TSV Development Technologies

      Choon Lee
     Jan 4, 2013

    3D TSV Development Technologies - Key Development Technologies for TSV, uBumping on Front and Back Side, TSV Via Reveal, Passivation & Pad Finishing, Thin Wafer Handling Capability, Wafer Supporting System, “Chip on Wafer” Bonding Process, Thin TSV Die Stacking, Interposer Source Development, Two sources for Si interposers.

    Important Tags: 3D Technologies, TSV Development Technologies, Thin Wafer Handling Capability
    Views: 3699
    Domain: Electronics
    Category: Semiconductors

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