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    3DIC Integration with TSV – Current Progress and Future Outlook

      Shan Gao, Dim-Lee Kwong
     Dec 14, 2010
    Description:

    Why 3DIC?, Pre-positioning Strategy for More than Moore, 3D TSV Application Status, 3D TSV Market Drivers, 3D TSV Packaging Market Forecast, 3D IC Technology Development in IME, 3D TSV Integration Process Flow, TSV Fabrication Process, TSV Fabrication Process Challenges, Process Challenges Cu Protrusion, Interconnection – Cu-Cu Wafer Bonding, Interconnection - Fine Pitch Micro-Bump, Thin Wafer Handling - Temporally Bonding/Debonding, Chip Stacking Process, Sensor Chip Design For Reliability

    Important Tags: 3D TSV Application Status, 3D TSV Market Drivers, 3D TSV Packaging Market Forecast, 3D IC Technology
    Views: 6543
    Domain: Electronics
    Category: Semiconductors


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