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    Advanced Assembly and Packaging for Automotive Electronics

      Klaus-Dieter Lang
     Feb 24, 2016
    Description:

    Systemintegration Technologies on Wafer and Panel Level: Based on semiconductor thin film technology equipment, Tightest tolerances for fine pitch line/space (2/2 μm), 2,5D and 3D assembly, Currently limited to 12” – 300mm, Based on PCB and manufacturing equipment, Embedding of acitves and passives, Double sided routing are standard features for PCBs, Line/space down to 10/10 μm with forecast to 5/5 μm within the next years, Full format/large area is standard today.

    Important Tags: Sensor Integration, Smart System Integration, Power Electronic Systems, Hybrid Car, Sensor Systems
    Views: 2258
    Domain: Electronics
    Category: Semiconductors


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