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    Advanced automated packaging and testing equipment to allow high volume manufacturing

      Torsten Vahrenkamp
     Jun 8, 2017

    What are the real production volumes? Photonics packaging lacks standards. The technology ‘bits’ are all available today. Design and processes need to target automation from the very beginning. Automation is the key With the increase of manufacturing volumes and the decrease of PICs cost SPEED will be the major challenge in machine design. The challenge can not be taken by the equipment vendors alone

    Important Tags: testing equipment, Advanced automated packaging, high volume manufacturing
    Views: 1362
    Domain: Electronics
    Category: Semiconductors

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