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    Advanced Semiconductor Packaging Technologies: Implications For First Movers and Fast Followers

      Seunghyuk Choi, Christopher Thomas, Florian Weig
     Dec 19, 2016

    The commercial reality for most integrated-circuit (IC) manufacturers is that node migrations and changes in wafer sizes are slowing down even as capital expenditures are increasing. One way for manufacturers to preserve their edge on their circuits’ small sizes, low costs, and high performance is to incorporate newer chip-packaging options such as 2.5-D integrated circuits (2.5DICs) and 3-D integrated circuits (3.0DICs) into their production processes. These advanced packaging technologies, many of which are still in their infancy, promise greater chip connectivity and lower power consumption compared with traditional packaging configurations.

    Important Tags: Semiconductor Technologies, Advanced Packaging Technologies, Semiconductor, Integrated Circuit
    Views: 1487
    Domain: Electronics
    Category: Semiconductors

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