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    Semiconductor and Equipment Driving Forces

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    Reports covering trends that drive demand for semiconductor manufacturing from the macro-economy, to electronics, semiconductors, as well as chip making equipment, electronics-materials, design tools, silicon, and reticles.

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    Silicon Demand

    Worldwide consumption of wafers and in area for 300mm, 200mm, and <200mm wafer sizes. Semiconductor production of wafer starts and wafer area for CD ranges that cover >=200nm, 180nm, 130nm, 90nm, 65nm, 40nm, 28/32nm, 20/22nm, and <20nm. Third sheet is area by device type with 38 line items, including microprocessors, microcontrollers, DRAM, Flash Memory and Linear. Includes five year history and forecast.

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    Silicon Demand by Linewidth of Device Type

    Data for semiconductor production in wafer area for Flash Memory, DRAM, MPU, Other MOS Logic (Other MOS Logic is the sum of DSP, MCU, MPR, and other CMOS Logic), Other (Total of SRAM, MASK PROM, Other CMOS Memory, Linear, Bipolar, and Discretes) and Total Semiconductors. Gives wafer area for these five segments broken into CD ranges that cover >=200nm, 180nm, 130nm, 90nm, 65nm, 40nm, 28/32nm, 20/22nm, and <20nm. Includes more than a five year history with a five year forecast.

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    Reticles

    Worldwide data for merchant and captive mask production in units, prices, and dollars ($ US) broken into CD ranges that cover >=200nm, 180nm, 130nm, 90nm, 65nm, 40nm, 28/32nm, 20/22nm, and <20nm. Gives wafer area for these five segments broken into CD ranges that cover >=500nm, 250nm, 180nm, 130nm, 90nm, 65nm, 40nm, 28/32nm, 20/22nm, 14/16nm, 10nm, and <8nm. Includes five year history with a five year forecast. Includes more than a five year history with a five year forecast.

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    Design Completions

    Data for semiconductor designs completed / finished by year included New first-off Designs and Revised daughter Designs that are derived from first-off mother designs. Each broken into CD ranges that cover >=200nm, 180nm, 130nm, 90nm, 65nm, 40nm, 28/32nm, 20/22nm, and <20nm. Includes a five year history with a five year forecast.

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    Packaging Demand

    Report covers package demand by lead count in units and leads, type of package, bonding method, a one data set covering single year split with axes by device type. Line items for 12 lead categories covering SOT Other TO, Through-Hole Mount, SIP & ZigZag, DIP, PGA, Surface Mount, Chip Carriers, PLCC, BGA, LGA, CSP/WLP, Quad Flat Pack, Quad Flat Non-leaded Ceramic, Small Outline, SOIC, TSOP & STSOP, SON, SOJ, and Smart Cards. BGA: Ball Grid Arrays, CSP: Chip-Scale Package, DIP: Dual In-Line Package, PGA: Pin Grid Arrays, PLCC: Plastic Leaded Chip Carrier, SOIC: Small Outline Integrated Circuit, SOJ: Small Outline J-Leaded, SON: Small Outline Non-Leaded, STSOP: Shrink Thin Small Outline Package, TO: Transistor Outline, TSOP: Thin Small Outline Package, WLP: Wafer Level Package

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