Total Advanced Packaging Wafers Expected to Grow 10% in 2021

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    ForecastPro Module:

           - Advanced Packaging - V21.02

    We expect Wirebonded semiconductor packages to continue to lose share over the next few years, accounting for nearly 50% of all interconnects in 2025 versus 58% in 2020. FlipChips will account for 26%, WLP 24%, and FoWLP 1% in 2025.


    Total Advanced Packaging Wafers expected to grow 10% in 2021

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