Total Advanced Packaging Wafers Expected to Grow 10% in 2021

Updates to Semiconductor Market Research Services on Website & Mobile App:

ForecastPro Module:

       - Advanced Packaging - V21.02

We expect Wirebonded semiconductor packages to continue to lose share over the next few years, accounting for nearly 50% of all interconnects in 2025 versus 58% in 2020. FlipChips will account for 26%, WLP 24%, and FoWLP 1% in 2025.

Click here to get more information about Semiconductor Chip Market Research Services