Updates to Semiconductor Market Research Services on Website & Mobile App:
- Assembly - Yearly & Quarterly
- Total IC - Yearly & Quarterly
- Equipment Definition
Assembly equipment sales bounced back in 2020, increasing 20% after declining for two consecutive years. Bonding Equipment had a strong year with sales jumping 25%. Ball Bonders outperformed their peers, soaring 69% followed by Die Bonders, up 13%. Companies that performed well in these segments were: BE Semiconductor Industries, ASM Pacific Technology, Kulicke & Soffa, Fasford Technology, Shinkawa, and Hoson.
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