Updates to Semiconductor Market Research Services on Website & Mobile App
- Packaging Demand – V20.07
CSP/WFN and SON packages will be the only segments to increase in 2020. These packages are used primarily in applications where the board real estate is at a premium, such as in smartphones and other portable electronic devices. The total number of leads is expected to be flat this year due to weak semiconductor unit volumes, which are projected to decrease low single digits. The number of pins-per-package will increase 3% in 2020. More than 60% of interconnects will be peripherally bonded in 2020.
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