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    Copper RIE Interconnect Technology for IC Energy Efficiency

      Nagraj S. Kulkarni
     Sep 30, 2010
    Description:

    OAK Ridge national Laboratory, CuRIE Interconnect Technology for Improved Energy Efficiency in IC Chips, ARPA-E Technology Innovation Showcase, Washington D.C. March 1-3, 2010, Copper Interconnect Manufacturing Technologies: Dual-damascene vs CuRIE, Scientific Basis - Understanding Electron Scattering, Size Effects in Thin Films, Size Effects in Damascene Nanowires, Copper Grain Boundary Resistively Measurements with Four-Probe Scanning Tunneling Microscopy, Modeling Interconnect Resistance.

    Important Tags: OAK, OAK Ridge national Laboratory, CuRIE Interconnect Technology
    Views: 2911
    Domain: Electronics
    Category: Semiconductors


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