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    Current Status, Challenges, and Outlook of EUV Lithography for High Volume Manufacturing

      Britt Turkot
     Aug 29, 2018
    Description:

    Materials performance – Won’t gate introduction of EUV, but need to consider stochastics for decreasing feature sizes and high NA: need to understand the interaction of EUV radiation with resist and design resist materials for stochastics.

    Important Tags: Intel Corporation , EUV Materials , HVM insertion
    Views: 3049
    Domain: Electronics
    Category: Semiconductors


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