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    Engineered Substrates for Future Compound Semiconductor Devices

      T.Uhrmann
     Dec 27, 2011
    Description:

    Engineered substrates are gaining importance with the increasing market size of compound semiconductor devices, Different technologies for the creation of engineered substrates have been introduced: Nano imprint Lithography, Wafer bonding, Temporary bonding, Engineered substrates will play an important role for the implementation of compound semiconductors on silicon. Monolithic device layouts, Higher integration and miniaturization, Engineered growth substrates for HB-LEDs offer a high potenti

    Important Tags: Engineered Substrates, Future Compound Semiconductor Devices, Compound Semis
    Views: 4980
    Domain: Electronics
    Category: Semiconductors


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