Getting below 10nm by breaking the low k barrier

     Hash Pakbaz     SBA Materials Inc.
      30406      Jun 9, 2015
    Liquid Phase Self-Assembly (LPSA) technology and it's importance: Now that the semiconductor industry has settled on the finFET, it's back to fretting about interconnect, which has become the larger limitation below 10 and 7nm due to power loss and signal integrity. That's put the focus back on dielectrics and getting to a lower k value.  Liquid Phase Self-Assembly (LPSA) technology is possibly the answer. The finished material is essentially the same as today’s CVD films. As the film self-assembles, it introduces ordered porosity. This makes the finished film structurally stronger at larger pore sizes, thus lowering the dielectric constant (k) value to 2.2 and below.
    In this video we have a conversation about this with Hash Pakbaz Ph.D., who is President and CEO of SBA Materials.

    About weVISION: weVISION is a series of video interviews of visionaries by G Dan Hutcheson, his career spans more than thirty years, in which he became a well-known as a visionary for helping companies make businesses out of technology. This includes hundreds of successful programs involving product development, positioning, and launch in Semiconductor, Technology, Medicine, Energy, Business, High Tech, Environment, Electronics, healthcare and Business divisions.
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