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    Leadless Flip Chip PLGA For Networking Applications

      Andrew Mawer, Paul Galles Steve Safai, Trent Uehling
     Aug 8, 2017
    Description:

    Initial SMT assembly trials with 1:1 stencil and only minimal (<10 mm) solder on LGA pads resulted in some outer row solder joint opens. Decision made to provide 100 mm pre-applied solder bumps on the package LGA pads

    Important Tags: Networking Applications, PLGA, NSMD vs SMD
    Views: 1208
    Domain: Electronics
    Category: Semiconductors


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