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    MEMS Packaging Technology Trends

      KC Yee
     Jan 5, 2011
    Description:

    MEMS Applications Across 4C, MEMS Growth in Consumer Market, Working Principles, Gyroscope Image stabilization, Observations of MEMS Market, High Values in MEMS Packaging & Test, MEMS Packaging Challenges, Realize Emerging MEMS Package, Packaging Technology & Cost Trend, ASE MEMS Technology Building, TSV 3D IC Market Applications, Adoption of 3D Packaging in Sensor MEMS, Versatile MEMS Microphone Packaging Solution, Adoption of 3D Packaging in Microphone, MEMS Microdisplay Packaging

    Important Tags: MEMS Applications Across 4C, MEMS Growth in Consumer Market, MEMS Packaging Challenges, Packaging
    Views: 4435
    Domain: Electronics
    Category: Semiconductors


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