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Intelligence to make better decisions faster

The Chip Insider® Live Interviews
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interviews date duration
Doug Andrey, SIA's Fin. Dir. and Principal Industry Analyst, on....
Forecasting 2004
   Audience Q&A
16 Dec 2003 13m55s
   
           
Mark Bohr, Intel Fellow and Dir. of Process Arch. and Int., on....
Intel's 65nm Process
    20 Nov 2003 10m20s
       
           
Jack Trautman, Sr VP & GM of ATE Group at Agilent, on...
Is Test Adding More Value than Wafer Fab Today?   
18 Nov 2003 23m46s
   
  Audience Q&A     18 Nov 2003 15m54s
           
Bernie Meyerson, CTO at  IBM's Microelectronics Division, on....
The Road Ahead in Semiconductors
05 Nov 2003 22m35s
   
           
Ken David, Director of Components Research, Intel, on...
Developments in Hi-k materials
27 Oct 2003 15m25s
   
           
Lithography Panel:
Bill Arnold, ASML; Gene Fuller, Nikon; and Phil Ware, Canon,
on...   193 immersion, 157nm, EUV, etc
.
22 Oct 2003 45m14s
   
  1) Do any of you believe that 193 immersion will not work?
   Is 157nm 2-3x more expensive?

2) Have you had any trouble dropping tool on dock (i.e.,  
    
getting acceptance)?   How do you get to the next sale?
22 Oct 2003

22 Oct 2003
05m43s

04m45s
  3) Will your lives be easier if design rules are restricted?
4) Possibility of new technology between now and EUV?
5) Is there a narrowing of options in lithography enhancing
   
techniques?
22 Oct 2003
22 Oct 2003

22 Oct 2003
04m58s
03m28s

03m04s
  6) What is the highest NA and the lowest k you can expect
    
on 193nm dry?
22 Oct 2003 01m37s
           
Mark Jagiela, President of Teradyne Semi Group, on... 
The Benefits of Multiple Test Platforms and Open Architecture:

1)
What will be the prevailing Open architecture?
12 Aug 2003

12 Aug 2003
15m54s

01m02s
  2) Is it possible to have a non-partisan consortium? 12 Aug 2003 02m34s
  3) Teradyne joining consortium? 12 Aug 2003 01m08s
  4) Tester companies don't die. Why?  12 Aug 2003 05m00s
           
Hans Stork, Senior Vice President of Silicon Technology Development at Texas Instruments,  on...
How TI’s Decision-Making Process Yields Competitive Advantage:
stock
18 Jul 2003

18m58s

  1) Is there a role for E-beam tools for low-volume parts? 18 Jul 2003 03m25s
  2) Low-k Materials 18 Jul 2003 01m43s
  3) Has the level of customer involvement in technology development changed? video 18 Jul 2003 02m08s
  4) What's your view of optical interconnects? video     18 Jul 2003 01m43s
           
       
  This New Tool:
The Chip Insider® checks out Genus's new Stratagem® 300
video
09 Jul 2003 16m07s
   
Mark Bohr, Intel Fellow, Director of Process Architecture and Integration, on....
The Launch of P1262 90nm Process.
09 Dec 2002 28m50s
       

Video Streaming:

These are exe files, once downloaded you can extract the video file and play. These videos can be viewed by Microsoft Media Player included with Microsoft Windows.
 

exec date file
New Reality for Test: Paul Magliocco   18 Jun 2003 38.2MB
  1) Structural vs Functional Test?   18 Jun 2003 7.6MB
  2) NexTest's Position on Open Architecture?    18 Jun 2003 4.1MB
     
Start-up in Semi Equipment Industry: Julio Guardado   20 May 2003 51.7MB
  1) What do you have to do to protect your IP?    20 May 2003 3.9MB
 
Advanced Process Control: Dick Deininger   22 Apr 2003 69.4MB
  1) Where is APC used?    22 Apr 2003 2.8MB
  2) Joint Process Development with IBM   22 Apr 2003 5.5MB
 

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