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VLSI Industry Code (VIC) Definitions

VIC Code VIC Name Full Definition
1 Corp. Total Total corporate revenues from all sources.
2 Div. Total Total revenues of all divisions within the company that offer semiconductor capital equipment.
3 Group Total Total revenues of all semiconductor equipment groups that exist within larger divisions. (Not widely used.)
4 Total Semi Eqpt Revenues Total corporate revenues derived from all sources of semiconductor capital equipment. The value of this data is the sum of the values of VIC codes 4.3 and 4.4
4.3 Total Service & Support Revenues Total corporate revenues from all sources of service, support, spares, upgrades and refurbishment derived solely from semiconductor and related capital equipment.
200 TOTAL CRITICAL SUBSYSTEMS: Subsystems that have been designed to address specific applications within the semiconductor and related manufacturing industries and actively affect the processing and handling of substrates.
203 Test Subsystems & Consumables Probe cards, sockets, device interface boards as well as test instrumentation
204 Masks and Reticles Masks and reticles
205 Assembly Subsystems & Consumables Wedges, capillaries, dicing tape, etc.
210 Fluid Management Subsystems Subsystems used to deliver, measure, control and analyse gases and liquids.
211 Gas Delivery Subsystems Subsystems used to deliver, measure and control the flow of gas.
211.1 Mass Flow Controllers Mass Flow Controllers used for controlling the flow of gas.
211.11 MFCs - Thermal Based Thermal Based Mass Flow Controllers
211.12 MFCs - Pressure Based Pressure Based Mass Flow Controllers
211.19 MFCs - Other Technologies Mass Flow Controller using Other Technologies
211.2 Gas Flow Measurement Instrumentation for measuring the flow of process gas.
211.9 Other Gas Delivery Subsystems Other gas delivery subsystems used for the delivery of process gases into systems, process chambers or modules.
212 Liquid Delivery Subsystems Subsystems used to deliver, measure and control the flow of liquids.
212.1 Liquid Flow Controllers Liquid Mass Flow Controller used for controlling the flow of liquid.
212.2 Liquid Flow Measurement Instrumentation for measuring liquid delivery.
212.9 Other Liquid Delivery Subsystems Other liquid delivery subsystems used for the delivery of liquids into systems, process chambers or modules.
219 Other Fluid Management Subsystems Other fluid delivery subsystems.
220 Integrated Process Diagnostics Integrated metrology subsystems for monitoring the substrate and process environment.
221 Gas Analysis Subsystems for analysing the composition and other characteristics of process gasses
221.1 Residual Gas Analizers Subsystems for analysing the composition gas in the process vacuum chamber. Typically used for end-point detection
221.2 FTIR Gas Analysis Subsystems used for measuring the composition of gases in the process exhaust line.
222 Liquid Analysis Subsystems used for measuring the composition of liquids.
224 Particle Measurement Subsystems Subsystems for measuring & counting particles suspended in the gases or liquids within the process tool. Typically using scatterometry techniques.
224.3 Particle Measurement - Gas Subsystems for measuring & counting particles suspended in the gas within the process chamber. Typically using scatterometry techniques.
224.4 Particle Measurement - Liquid Subsystems for measuring & counting particles suspended in liquids. Typically using scatterometry techniques.
227 Integrated Substrate Metrology Systems Metrology systems which are directly integrated inside substrate processing tools.
229 Other IPD Other measurement and analysis subsystems integrated into the process system.
230 Optical Subsystems Illumination and lens subsystems.
231 Light Source Subsystems Illumination subsystems
231.1 DUV Photolithography Sources Excimer laser illumination subsystems for deep ultraviolet lithography tools
231.2 Photolithography Light Sources Lamp controllers and associated power supplies for photoligraphy tools
231.9 Other Light Source Subsystems Other laser and light source subsystems
232 Lens Subsystems Lens Subsystems
232.1 Lithography & Mask Lens Subsystems Optical Subsystems for Lithography. Includes Lens Column & DUV Illumination optics
232.9 Other Lens Subsystems Other Lens Subsystems
239 Other Optical Subsystems Other critical optical subsystems not included elswhere.
240 Power and Reactive Gas Subsystems Power Subsystems including power supplies, matching networks, instrumentation and related products for generating, controlling and measuring power delivered to the process chamber. Segment also inculdes reactive gas generating subsystems using RF or MW power to create a reactive gas remote from the process chamber.
242 Process Power & Instrumentation Process power subsystems operating between DC and 60MHz, and instrumentation for monitoring or measuring power delivered to the process chamber
242.1 DC and RF Power Subsystems Process power subsystems operating between DC and 60MHz
242.11 DC Process Power DC Power for Sputtering, Ion Implant and Electroplating
242.12 RF Power Subsystems RF Power Subsystems operating in the range of 40KHz to 100MHz at power levels in excess of 500W used for plasma processing and induction heating
242.122 RF Power Supplies RF Power Supplies operating in the range of 40KHz to 100MHz at power levels in excess of 500W used for plasma processing and induction heating
242.123 RF Power Matching Networks Impedance matching networks used in conjunction with HF, LF and MF power supplies
242.3 Microwave Power Subsystems Microwave power supplies, matching networks and controllers operating at frequencies above 2GHz for plasma generation
242.4 Power Instrumentation Subsystems Equipment used for measuring the electrical properties of a plasma or process.
245 Fluorine Gas Generator Power Subsystem. Power subsystem for producing reactive fluorine
249 Other Process Power Subsystems Other process power subsystems used for generating a plasma or providing power to the process chamber
250 Thermal Management Subsystems Subsystems for controlling and measuring temperature
251 Cooling Subsytems Subsystems used for cooling substrates, liquids, gases or chamber components
251.1 Thermal Control Subsystems Thermal control subsystems for maintaining temperature of substrate and/or process chamber
251.11 Chillers Recirculating gas or liquid chillers and associated control subsystems
251.12 Heat Exchangers Cooling subsystems using control of secondary cooling circuit which transferrs energy to or from fab cooling system
251.9 Other Cooling Subsystems Other cooling subsystems
252 Heating Subsystems Wafer chuck or chamber heating subsystems
253 Temperature Measurement Subsystems Subsystems used for the measurement of temperature.
253.1 Thermocouple Thermometry Subsystems Temperature measurement subsystems using contact with surroundings via thermocouple probes
253.2 Optical Fibre Thermometry Subsystems Temperature measurement subsystems using optical detection of IR emissions from wafer surface.
259 Other Thermal Management Subsystems Other thermal management subsystems
260 Vacuum Subsystems Subsystems used to generate, control and measure a vacuum
261 Vacuum Pump Subsystems Subystems used to generate a vacuum.
261.1 Dry Pump Pumping action through mechanical compression without use of oil. Includes roots, booster, scroll, rotary vane and other dry mechanical pumps.
261.2 Turbomolecular Pump Pumps using the action of a fast moving surface to develop pressure difference. Includes drag pumps, mechanical turbo pumps and magnetically levitated turbopumps.
261.3 Cryopump Pumps that rely on the dispersion forces existing between a gas and a surface to bind gas molecules on chilled surfaces inside the pump
261.9 Other Vacuum Pumps Other vacuum pumps including ion pumps, diffusion pumps and diaphragm pumps.
262 Pressure Sensing and Control Subsystems Subsystems used to measure a vacuum
262.1 Pressure Gauges - Capacitance High accuracy pressure sensors and associated control systems using a Capacitance Manometer to sense pressure. Includes combination gauges with capacitance manometers.
262.2 Pressure Gauges - Electronic Electronic pressure guages - Pirani, Bayer-Appleton and Ion Gauges
269 Other Vacuum Subsystems Other critical vacuum subsystems and instrumentation not included elswhere
270 Wafer Handling Subsystems Subsystems used for moving and aligning substrates within process tools
271 Wafer Transport Subsystems Subsystems used for moving substrates within the processing tool
271.1 Robotic Subsystems Robotic subsystems for moving substrates within a process tool
271.11 Dry Robotic Subsystems Robotic subsystems used for dry environments
271.111 Vacuum Robots Robots for use within a vacuum chamber
271.112 Atmospheric Robots Robots for use at atmospheric pressure
271.12 Wet Robotic Subsystems Robotic subsystems used for wet environments
271.2 Linear Motion Subsystems Wafer stages
273 Wafer Aligning / Vision Subsystems Optical subsystems for aligning the substrate within the process chamber
274 Load Ports Wafer Loaders/Unloaders
279 Other Substrate Handling Subsystems Other substrate handling systems
280 Integrated Subsystems Total value of integrated subsystems
280.1 Integrated Subsystems - Value Added Total value of integrated subsystems over and above the value of the subsystems integrated elsewhere
280.2 Less Value Of Subsystems Reported Elsewhere * Integrated subsystems generally contain subsystems which have been reported in other segments. To avoid double counting, revenues equal to the value of those subsystems are deducted from the total sales value of integrated subsystems
281 Ozone Generating Subsystems Subsystems for generating ozone
281.1 Gaseous Ozone Subsystem Ozone gas generating subsystems
281.2 Liquid Ozone Subsystem Liquid ozone generating subsystems
282 Helium Backside Cooling Subsystem Chuck assembly and associated pressure and flow control subsystem for Helium backside cooling
283 Vapour Delivery Subsystems Vaporizer subsystems for delivery of liquid precursor
284 Gas Panels On tool gas delivery subsystems
285 Integrated Wafer Handling Subsystems Wafer handling modules associated with substrate processing equipment
289 Other Integrated Subsystems Integrated subsystems not included elswhere
290 Other Subsystems Other critical subsystems not included elsewhere
291 Vibration Isolation Subsystems Subsystems for damping vibrations from moving parts and other equipment
292 Point of use Abatement Subsystems Gas cleaning or abatement subsystems attached to exhaust of process tools
299 Other Undefined Subsystems Other undefined subsystems
1004 Total IC Mfg Eqpt Total Revenues for Semiconductor Manufacturing Equipment and Service
1004.3 Total Service & Support Total revenues from all sources of service, support, spares, upgrades and refurbishment for semiconductor capital equipment.
1004.4 Total System Sales Total revenues for system sales of semiconductor capital equipment. The value of this data is the sum of the values of the class of lowest numbered VIC objects between VIC codes 1300.0 to 1560.0
1300 Test and Related Systems Testers, Handlers and Probers
1330 Automated Test Systems Automated Test Systems
1334 Memory Test Systems Memory Testers
1334.2 Memory Test by Type Memory testers by memory type.
1334.23 DRAM Memory Test DRAM memory testers
1334.233 Conventional DRAM Test DRAM testers below 1Gbit/s datarate
1334.2333 Conv. DRAM Sort Test Conventional DRAM tester for final test.
1334.2334 Conv. DRAM Final Test Conventional DRAM tester for wafer sort test.
1334.234 High Speed DRAM Test DRAM testers egual or greater than 1Gbit/s datarate
1334.2343 High Speed DRAM Sort Test High Speed DRAM tester for final test.
1334.2344 High Speed DRAM Final Test High Speed DRAM tester for wafer sort test.
1334.24 Flash Memory Test Systems Memory testers to test Flash memories.
1334.243 NAND Memory Test Testers that are used primarily to test NAND flash memory devices.
1334.2433 NAND Sort Test NAND tester for final test.
1334.2434 NAND Final Test NAND tester for wafer sort test.
1334.244 NOR Memory Test Testers that are used primarily to test NOR flash memory devices.
1334.2443 NOR Sort Test NOR tester for final test.
1334.2444 NOR Final Test NOR tester for wafer sort test.
1334.29 Other Memory Test Memory testers to test other memory devices. These include SRAM, EPROMS, mask ROMS etc.
1334.293 Other Memory Sort Test Other memory tester for final test.
1334.294 Other Memory Final Test Other memory tester for wafer sort test.
1335 Linear and Discrete Test Systems Traditional Linear and Analog IC test, and Discrete device test.
1335.7 Traditional Linear Test Systems Traditional Linear Test systems covers all testers used for testing op amps, voltage regulators and other traditional linear IC devices.
1335.8 Discrete Test Systems Discrete Test category contains testers for all active discrete devices.
1336 Systems-on-a-Chip Test Systems System-On-a-Chip (SOC) testers must have the capability to test logic, memory and either mixed signal or analog-integrated circuitry.
1336.2 SOC Test by Application System-on-a-chip testers segmented by end use application.
1336.23 SOC Test for Computing SOC testers for testing devices that are used in computing systems. These systems include PC's, Servers, Datastorage. The typical devices are MPU's, graphics processors, and chipsets.
1336.233 SOC Testers for Micro Processors Testers for MPUs.
1336.234 SOC Testers for Graphics Processors Testers for Graphics Processors.
1336.239 SOC Testers for other computing Testers for Datastorage & chipsets.
1336.24 SOC Testers for Communications SOC testers for testing devices that are used in communications systems. This segment is divided into wired and wireless systems.
1336.243 SOC Testers for Wired Comm. Wired communications systems include all hardware related to data, broadband and voice communications. The typical devices are network processors, transceivers, serdes, sonet, LAN & WAN devices.
1336.244 SOC Testers for Wireless Comm. Wireless communications systems include all hardware related to wireless and RF communications. The systems include cell phones, cordless phones, pagers, WLAN, GPS, and digital satellite receivers.
1336.25 SOC Testers for Consumer Electronic devices and applications that are for consumer use outside computing and communications. These include Audio/Video systems, digital cameras, HDTV, DVD, Game boxes, MP3 Players, PDAs, etc.
1336.26 SOC Testers for Automotive All devices specifically manufactured for automotive applications.
1336.29 SOC Testers for Specialty Specialty systems are typically Military, Medical and Industrial applications. This also includes smart power devices.
1337 Burn-in Test Systems The purpose of burn-in test is to stress-test the components in a manner that will force weak, unreliable devices to fail prematurely, while not overstressing the normal components. This is typically done by heating the components to higher temperature for predetermined time while conducting the test.
1340 Handlers and Probers Material handling system serves as a interface between tester and device. This category includes Probers, Handlers and Laser Repair stations.
1343 Wafer Probing Probers serve as a interface between tester and device when the device is still in wafer form. The electrical contact is made through pins in probe card that contact the pads on the die.
1343.5 Automatic Wafer Probers Automatic prober aligns wafer to the electrical probe points that make the contact to each die, steps to the next die, makes contact automatically.
1343.6 Engineering Probers Engineering probers are manual or semiautomatic probers used for first silicon and other engineering applications
1344 Package Handling Equipment Handlers move the DUT into testers and provides mechanical and electrical interface between the test system and the packaged DUT.
1344.1 Gravity Feed Handlers A package level handler where the transport mechanism for the DUT is gravity.
1344.2 Pick and Place Handlers A handler system where the transport mechanism fo the DUT is a robotic arm.
1344.8 Test in Strip L/F Handlers A handler system used to move the DUT in strip or matrix leadframes and test in situ.
1344.9 Misc. Handlers Miscellaneous handlers that can not be categorized as gravity feed, pick and place or strip handlers.
1345 Laser Repair Stations Laser repair systems uses laser to modify the circuitry in the die by either cutting off defective memory cells or trimming predetermined resistors to fine tune device characteristics to the specs.
1400 Wafer Fab Equipment (WFE) Equipment that is used to manufacture ICs on wafers.
1430 Microlithography and Mask Making Eqpt Tools used to define the patterns on masks and transfer those patterns onto photoresist on the substrate surface. Includes resist processing equipment.
1432 Microlithography Eqpt. by Application Lithography systems that are segmented by the use of the system.
1432.4 Wafer Exposure Eqpt. by Application Wafer exposure equipment that segmented by use of the system.
1432.43 Exposure Tools for ICs Exposure tools used in the manufacture of semiconductors
1432.44 Exposure Tools for LCDs Exposure tools used in the manufacture of flat panel displays
1432.45 Exposure Tools for TFHs Exposure tools used in the manufacture of thin film heads and magnetic discs
1432.46 Exposure Tools for MEMs Exposure tools used in the manufacture of Micro Electro Mechanical devices
1432.47 Exposure Tools for Packaging Exposure tools used for packaging of ICs. These lithography steps come after passivation layer.
1432.49 Misc. Exposure Tools Exposure tools used for miscellaneous applications
1433 Resist Processing Equipment Equipment used for processing photoresist before and after exposure. Typical process modules include priming, coating, developing, curing, heating and cooling.
1434 Wafer Exposure Equipment Equipment used to expose a photoresist on substrate
1434.3 Optical Exposure Equipment Exposure equipment that use optics to project the image. These include aligners, steppers and scanners
1434.33 Mask Aligners Contact, proximity and scanning projection aligners
1434.35 Imprint Lithography Imprint lithography systems use a pre-patterned template to create patterns on a wafer. Photoresist is distributed between the substrate and the template. Photoresist is then exposed to light resulting in a three dimensional pattern replication on the substrate.
1434.36 Scanners and Steppers Exposure equipment using lenses to project a miniaturized image of the mask onto the substrate. One mask can no longer expose the entire substrate so the same image is repeatedly moved and exposed until the whole substrate has been exposed. This includes steppers and scanners
1434.363 H/G line steppers Lithography exposure tools using light sources at 405nm wavelength (H-line) or 436nm wavelength (G-Line)
1434.364 I line steppers Lithography exposure tools using light sources at 365nm wavelength (I-line)
1434.365 DUV scanners Lithography exposure tools using deep ultra violet (DUV) light sources with wavelengths =<248nm
1434.3653 248 nm scanners Lithography exposure tools using light sources with deep ultra violet (DUV) wavelength at 248nm
1434.3654 193 nm scanners Lithography exposure tools using light sources with deep ultra violet (DUV) wavelength at 193nm
1434.36543 193 nm dry scanners Dry lithography exposure tools using light sources with deep ultra violet (DUV) wavelength at 193nm
1434.36544 193 nm immersion scanners Immersion 193nm lithography exposure tools using immersion fluid between wafer and lens
1434.366 EUV scanners Lithography exposure tools using light sources with extreme ultra violet (EUV) wavelength at 13nm
1434.4 Direct Exposure Systems Direct exposure systems use electron, ion beam or laser to directly write the image to wafer.
1434.45 Laser Beam Direct Exposure Lithography exposure tool using energy from a laser beam to expose the photoresist material.
1435 Mask Exposure Equipment Mask exposure equipment transfers a pattern of circuitry into a thin chrome layer on the glass mask. Mask exposure systems are typically direct write systems. The mask making process closely follows the general wafer patterning process.
1435.3 Pattern Generation Pattern generation equipment transfers the digital image of the pattern to the photoresist or directly removes the chrome layer from selected areas of the mask.
1435.34 E-Beam Mask Exposure An electron beam mask exposure system exposes the substrate with an electron beam. The system consists of an electron source capable of producing a small diameter spot, and a beam control subsystem. The beam passes through electrostatic plates that direct the beam in an X-Y direction of the substrate, exposing the photoresist.
1435.36 Laser Beam Mask Exposure A laser beam mask exposure system exposes the substrate with a laser beam. The mask blank is placed on an X-Y stage. The pattern file creates the driving signal for an acousto-optic modulator, which turns the exposure laser beam on and off. A lens in the fixed writing head focuses the beam onto the plate. The exposure beam is deflected in the Y direction as the stage is moved in the X-direction, creating an exposed scan strip of the pattern. This process is repeated until the plate surface is covered by adjacent scan-strips.
1440 CMP Equipment CMP (Chemical Mechanical Polishing) equipment planarizes wafer surface by polishing the wafer using a mechanical force to press the wafer against a rotating polishing pad onto which abrasive, reactant, slurries are dispensed.
1450 Ion Implant Eqpt. Ion implanters directly inject impurity dopants into the silicon surface of a wafer. A gas containing the desired dopant is ionized. The ions are extracted from the source and are accelerated through an electric field. The dopant ions thus gain sufficient energy to penetrate the silicon surface and become embedded below the surface. Ion implanters are classified in 4 categories: low/medium current, high current, high-energy (or high-voltage) and ultra high dose doping systems.
1453 Medium Current Implanters Medium current ion implanters use currents that range from about 5 microamperes to a few hundred microamperes. The systems are generally used for making MOS threshold adjustments and for resistors.
1454 High Current Implanters High current ion implanters use currents that range from about 750 microamperes to more than 25 milliamperes. Since implanted dopant density is directly proportional to ion beam current, the higher the current, the higher the maximum wafer throughput capacity of the implanter for a given doping density.
1455 High Voltage Implanters High voltage ion implanters have the ability to implant ions very deeply by accelerating ions to very high energy. Most high-energy systems are only capable of beam currents of 5 to 50 microamperes but can produce ion energies well into the 2-3 MeV range. Uses for high energy systems include deep wells in CMOS, 3-dimensional interconnects, retrograde doping profiles, and buried insulating layers of silicon dioxide and silicon nitride.
1456 Ultra High Dose Doping Systems Implanters and doping systems for high dose (Typically >1 E15 atoms/cm2)
1460 Deposition & Related Tools Deposition is the process of laying down a thin film of material on the surface of a silicon wafer. Semiconductor manufacturing process use numerous different films, sandwiched on a wafer. These layers form the wires and insulators that ultimately interconnect all of the transistors of the device being produced. There are number methods for depositing thin films. They are Chemical Vapor Deposition (CVD), Physical Vapor Deposition (PVD), High Temperature CVD (Epitaxy), Atomic Layer Deposition (ALD), Electro Chemical Plating (ECP) and Thermal Processs (RTP and Furnace).
1463 Deposition for IC Manufacturing CVD tools for Intergrated Circuit
1463.3 CVD Tools Deposition systems that use Chemical Vapor Deposition to deposit thin films to the wafer. The films can be dielectric or conductive films.
1463.31 APCVD Tools Atmospheric Pressure CVD; Systems that deposit this films at atmospheric or sub-atmospheric pressure. The films are typically Pre Metal Dielectric films.
1463.32 Plasma CVD Plasma CVD uses ionized plasma as energy source for depostion reaction. These are PECVD and HDPCVD Tools
1463.34 LPCVD Tools Low Pressure CVD: Use low pressure but not plasma to deposit films. Typical films are poly, W plug fill and Ti/TiN
1463.341 LPCVD - Metal LPCVD for W and Ti/TiN deposition
1463.342 LPCVD - Gate Formation LPCVD for poly gate formation
1463.35 MOCVD Tools Metal Organic CVD; Systems that use metal organic precursors to deposit the film.
1463.36 HTCVD Tools (EPI) High Temperature CVD; System that deposit films above 750C degrees. The system may also contain capability for low pressure CVD but the process chamber can handle higher temperatures than typical LPCVD system. These systems are depositing epitaxial layers
1463.361 HTCVD - Blanket EPI HTCVD tools sold typically to wafer manuafcturers to deposit blanket EPI film.
1463.362 HTCVD - Strain & Transistor Eng EPI HTCVD tools sold typcally to IDM for transistor engineering EPI films like SiGe strain.
1463.363 HTCVD - Other EPI HTCVD sold to applications like PowerMOS, IGBT etc.
1463.4 PVD Tools Physical vapor deposition to deposit thin films to the wafer. The films are conductive films.
1463.5 RTP Tools Rapid Thermal Processing; Systems that are capable of high temperature ramp rates by using lamps. In some cases hot plates or hot walls are used and wafers are moved into hot chamber to achieve high temperature ramps. Millisecond RTP systems are either laser or flash based Thermal processing tools. The advanced gate RTP tools combines RTP with plasma nitridation chamber.
1463.51 RTP - Conventional Conventional lamp based RTP tools. This category includes also hot wall and plate based RTP systems
1463.52 RTP - millisecond Millisecond RTP tools use laser or flash based thermal processing.
1463.6 ALD Tools Atomic Layer Chemical Vapor Deposition is a surface controlled layer-by-layer process for the depostion of thin films, one atomic layer at a time. This process is used to produce microstructures in semiconductor devices and in the production of large-area
1463.61 ALD - Plasma Enhanced Plasma Enhanced ALD
1463.62 ALD - Thermal Thermal ALD
1463.7 Diffusion/Furnace Tube based diffusion and deposition systems. They include Tube CVD, ALD and Diffusion systems
1463.8 Spin-on Deposition Similar to resist processing systems, spins liquids on the wafer to form the film. Typical films are Low-K IMD.
1463.9 Electro Chemical Deposition Uses electrolysis to deposit films. Typical application is Blanket Cu.
1464 Deposition for Advanced Packaging Post Passivation deposition tools are used for advanced packaging applications
1464.3 CVD - Adv. Packaging CVD tools for advanced packaging
1464.4 PVD - Adv. Packaging PVD tools for advanced packaging, this also includes backside metalization applications
1464.9 ECP - Adv. Packaging Electro Plating tools for advanced packaging and TSV
1465 Deposition for Compound Semi Deposition tools for Compound Semiconductor applications
1465.1 MOCVD - Compound Semi Metal Organic CVD systems used in compound semiconductor manufacturing
1465.2 MBE EPI Tools Molecular Beam Epitaxy; Systems that use electron beam to heat the target to liquid state. The atoms evaporate from the target and then deposit to the wafer. Typical applications are III-V compound.
1465.4 PVD - Compound Semi PVD tools for compound semiconductor applications
1466 Deposition for Disk Drive Mfg. Deposition tools for Disk Drive applications
1466.3 HDD - CVD CVD tools for HDD applications
1466.4 HDD - PVD PVD tools for HDD applications
1466.6 HDD - ALD ALD tools for HDD applications
1467 Deposition for MEMS Deposition tools for MEMS Applications
1467.3 MEMS - CVD CVD tools for MEMS applications
1467.4 MEM - PVD PVD tools for MEMS applications
1469 Deposition for Other Miscellanious deposition tools are not listed above.
1470 Etching & Cleaning Tools Tools used for cleaning, stripping, etching and thinning of substrates
1473 Dry Processing Systems using plasma for removal
1473.4 Etch Systems Etch tools
1473.42 Conductor Etch Etch for conducting silicon and metal films
1473.44 Insulator Etch Etch for dielectric films
1473.48 Advanced Packaging Etch Advanced Packaging Etch
1473.49 Misc. Etch Miscellaneous etch, such as reticle, TFH, GaAs and other
1473.5 Dry Stripping Tools Plasma removal of photoresist
1473.6 Ion Milling Tools Ion beam to mill desired feature on the wafer.
1473.7 Dry Cleaning Tools Plasma removal of films or particles
1474 Wet Processing Semiconductor manufacturing Equipment making use of liquid surfactants for etching, stripping & cleaning to remove particles, contamination, or other materials from the wafer, mask, quartz products, and containers.
1474.3 Wet Wafer Processing Systems Semiconductor manufacturing Equipment making use of liquid surfactants for etching, stripping & cleaning to remove particles, contamination, or other materials from wafers.
1474.33 Wet Wafer Processing by Configuration Wet wafer processing systems segmented by chamber configuration.
1474.333 Single Wafer Wet Processing Single waferwet processing systems.
1474.3333 Single Wafer Spin & Spray Single wafer spin & spray processors.
1474.3339 Other Single Wafer Wet Processing Other Single wafer wet processing systems except Spin & Spray. These include scrubbers, post-CMP cleaners, immersion, etc.
1474.334 Batch Wet Wafer Processing Automated wet processing system configured for batch processing of wafers.
1474.3343 Spray Batch Wet Wafer Processing Batch wet processing systems that uses spraying chemicals to the wafer to process them.
1474.3344 Wet Benches Batch wet processing systems that uses immersion for the process.
1474.339 Other Wet Wafer Processing Other wet wafer processing systems includes the systems not identified in other categories. These include manual wet wafer processing systems.
1474.4 Other Wet Processing Systems Other wet processing systems include cleaning equipment which removes impurities from the mask, quartz, and wafer containers.
1474.43 Reticle Cleaning Reticle Cleaning Systems
1474.49 Other Wet Processing Cleaning Systems for quartz and containers
1480 Process Diagnostic Equipment Process diagnostics equipment monitor and verify consistent and controlled manufacturing processes. These include equipment for wafer and reticle inspection, as well as process monitoring.
1483 Wafer Inspection Equipment Process diagnostics equipment that used for measuring and inspecting wafers.
1483.3 Film and Wafer Measuring Instruments Film and wafer measuring instruments include non-electrical measurements of wafers, surface and films.
1483.33 FTIR Fourier Transform Infrared Spectrometers (FTIR) measure film composition and film thickness via laser-generated infrared light.
1483.34 Film Thickness Instruments Instruments that are used to measure film thickness. These are ellipsometers, opto-acoustic and other instruments.
1483.343 Ellipsometers Ellipsometers measure transparent films.
1483.344 Opto-acoustic instruments Opto-acoustic instruments measure opaque films or stacks of different films.
1483.349 Other Film Thickness Instruments Other Film Thickness instruments.
1483.35 Wafer Flatness Instruments Wafer flatness mapping instruments measure wafer flatness in the optical plane across the surface of the wafer.
1483.36 Surface Profiling Instruments Surface profiling instruments measure and map the profile of wafer surface.
1483.363 Traditl Surface Profiling Optical instruments that are used in surface profiling.
1483.364 Atomic Force Microscopes Atomic force microscopes that are used in surface profiling.
1483.37 Wafer Measuring Instruments Wafer measuring instruments measure wafer characteristics such as taper, warpage, and bow.
1483.38 X-Ray Metrology Tools Various X-ray techniques to provide the composition, stack and thickness of films.
1483.39 Misc Metrology Tools Miscellaneous metrology and measuring instruments.
1483.4 Electrical Instruments Electrical instruments measure electrical characteristics of wafers or thin films. These systems include CV & DLTS plotters and misc electrical measuring tools
1483.5 CD Measuring Tools CD measuring tools are used the measure the critical dimensions of device structures and lithography overlay accuracy.
1483.53 Optical CD Measurement Optical CD Measurement Tools are used to scan across a wafer surface and measure patterned linewidths.
1483.54 CD-SEMs Tools which use scanning electron microscopes, usually at low voltages (typically <2kV), to measure critical dimensions.
1483.58 Overlay Measurement Overlay measurement tools are automated optical measurement tools used to control lithography overlay errors.
1483.59 Misc. CD Measuring Microsopes and imaging systems not listed anywhere else, that are used for CD measurement.
1483.6 Defect Inspection Tools Defect inspection systems are used to detect, analyze and characterize defects.
1483.62 Brightfield Inspection Brightfield inspection systems use a focused beam of broadband or multiple-wavelength light to flood illuminate the wafer. The system collects the reflected light in a high-speed Time Delay Integration (TDI) sensor, where the image is digitized by a small area
1483.621 Micro Brightfield Inspection Brightfield inspection for micro and nano size defects
1483.622 Macro Brightfield Inspection Brightfield inspection for macro size defects
1483.65 Darkfield Inspection Darkfield inspection uses a laser beam to illuminate the wafer surface at a low angle. This low angle minimizes the light scatter from the wafer surface and maximizes the scatter from defects and other anomalies.
1483.651 Patterned Darkfield Inspection Darkfield inspection tools for patterned wafers.
1483.652 Un-patterned Darkfield Inspection Darkfield inspection tools for un-patterned wafers.
1483.66 E-beam Inspection E-beam inspection measures emitted secondary electrons. Because electrons are not subject to limits of diffraction, they are able to detect much smaller defects than optical methods. E-beam has large depth of focus and, therefore, is also capable of ima
1483.67 Defect Review Stations Review stations use microscopes, SEMs or other methods to analyze defects or particle contamination.
1483.671 Manual Defect Review Manually operated defect review stations, includes Optical, SEM and Hybrid technologies
1483.672 Automated SEM Defect Review Automated on-line SEM review stations which use scanning electron microscopes, usually at low voltages (typically <2kV), to analyze defects or particle contamination.
1483.673 Automated Hybrid Review Automated review stations which use a combination of technologies like SEM & FIB to analyze defects or particle contamination.
1483.68 Other Inspection Other inspection includes manual and operator-assisted inspection and review stations, as well as other inspection technologies.
1483.7 Gen. Purpose Microscopy Tools General purpose microscopy includes HiV SEM, TEMs and other miscellaneous microscopy tools
1483.8 Global Metrology Systems Global metrology systems combine measurements of wafer flatness, taper, warpage, and bow in a single integrated system.
1483.9 Structural Inspection & Review Structural inspection and review systems use focused ion beam (FIB) to inspect and review structures in a wafer. FIB can also create 3D view of the inspected whole structure.
1484 Reticle Inspection & Repair Equipment Systems that are used to inspect or repair masks and reticles
1484.4 Reticle Inspection Systems All systems and microscopes that are used to inspect reticles and masks.
1484.41 Reticle Defect Inspection Tools for reticle defect inspection
1484.42 Reticle CD Measurement Tools for reticle CD measurement
1484.5 Reticle Repair Systems that are used to repair defective reticles and masks.
1485 Process Monitoring Electrical test systems to characterize wafer performance during manufacturing process in the fab
1485.3 Automatic Process Monitors Electrical test systems to characterize wafer performance during manufacturing process in the fab
1490 Other Equipment Other wafer manufacturing or processing equipment. They include wafer manufacturing and automation systems
1493 Wafer Manufacturing The systems that are used to manufacture wafers for chip making.
1493.3 Crystal Growing Furnaces Crystal growing furnaces are used to convert polycrystalline raw silicon into a correctly oriented large single crystal with the proper amount of dopant.
1493.4 Crystal Machining Crystal machining equipment consists of equipment used to cut and process the single-crystal ingots into thin production-worthy wafers.
1493.5 Wafer Bonders and Aligners The wafer bonders are used to join two or more silicon wafers by creating hydrophobic or hydrophilic surfaces. The bonder aligners are used to achieve the required micron level wafer-to-wafer alignment of two or more wafers to each other before wafer bonding process.
1493.6 Bevel Polishing Systems that are used to polish wafer bevel
1494 Automated Handling Systems Systems that are associated with transporting and storing wafers and reticles in the fab.
1494.6 Wafer Handling Systems Systems that store, transport and transfer wafers in the fab.
1494.62 Wafer Transport Systems Systems that transport wafers from bay to bay and within the bay.
1494.63 Wafer Transfer Systems Wafer sorters and other stand alone wafer transfer systems.
1494.64 Wafer Stockers Systems that is used to store and retrieve correct wafer pods, carriers etc. for processing.
1494.7 Reticle Handling Systems Systems that are specifically designed to store, retrieve and transport reticles in fab and lithography cell.
1494.72 Reticle Transport Systems Systems that transport reticles from stocker to steppers and back.
1494.74 Reticle Stockers System that is used to store and retrieve correct reticle(s) for wafer processing.
1497 Wafer Marking Systems These systems that typically use laser to mark the identification codes to wafers or dies when they are still in wafer form.
1500 Assembly Equipment Assembly equipment are chip making systems that are used to package the finished wafer into separate dies. These systems are used for inspection, dicing, bonding, and packaging semiconductors. They include associated inspection and marking systems.
1520 Assembly Inspection Equipment Assembly inspection systems are used to inspect dies, packages or wafers for defects during or before packaging process. This segment is divided into die inspection, bonding inspection, package inspection and other inspection categories.
1523 Wafer and Die Inspection Systems Wafer and Die inspection Systems are used to inspect dies or wafers after dicing, probing or incoming inspection after wafer process. These systems are automated optical inspection systems.
1523.3 3D Wafer Inspection 3D Inspection systems are used to inspect bumped wafers and bumps on the wafer level.
1523.4 Conv. Wafer and Die Inspection The systems are used to inspect wafers and dies except bumped wafer. Typically these inspection tools are for probe damage, scratches, past-dice kerf damage and surface faults.
1524 Bonding Inspection Equipment Bonding inspection equipment are used to inspect the quality of interconnect bond and wires. These systems typically are X-ray based that can image the complete package or simple bond pull strength testers.
1525 Package Inspection Systems Package inspection systems are used to inspect damaged leads.
1525.5 Area Array Lead Scanners The systems are used for BGAs, QFNs, CSPs and other area array packages. These inspection tools are also 3D capable.
1525.9 Other Package Lead Scanners The systems are used for other SMD packages and DIP packages.
1529 Other Assembly Inspection Other assembly inspections systems are die sorters and other systems that are not categorized anywhere else.
1530 Dicing Equipment The market for dicing equipment consists of four segments: blade saws, laser saws, dicing accessories and backside grinding. These systems are used to cut the wafer into separate dies, thinning the wafer and holding the cut wafer intact until the dies are bonded
1533 Blade Sawing Equipment Blade sawing equipment are diamond blade saws that are used to cut the wafer apart into dies
1534 Laser Sawing Equipment Laser sawing equipment are used to cut the wafer apart into dies
1536 Backside Grinding Equipment Backside grinding equipment are used to thin the wafer to specified thickness before dicing and packaging.
1537 Mounting Equipment These equipment mount both the film and wafer to the frame that are used to keep the wafer and saw dies in place during the dicing operation.
1540 Bonding Equipment Bonding equipment consists of Die attach, Wire bonders, and advanced interconnect equipment. These equipment are used to attach the die to leadframe or substrate and create interconnect between the die and lead frame or substrate
1543 Die Attaching Equipment Die bonders and die attach
1543.3 Die Sorting Equipment Systems that use robotic arm to sort the dies
1543.4 Die Bonding Equipment Die bonder detaches the diced die from the wafer and attaches it to a leadframe. The die bonder creates bond by eutectic or epoxy bond.
1543.41 Die Bonding - LED Die bonder for LED
1543.42 Die Bonding - CIS Die bonder for Image Sensor
1543.43 Die Bonding - Power & Discrete Die bonder for Power and Discrete
1543.44 Die Bonding - Conventional IC Die bonder for leadframe or substrate
1543.45 Die Bonding - Advanced IC Die bonder for SIP, thin die, stacked die
1544 Wire Bonding Equipment Wire bonders create interconnect between die pads and leadframes using wire. Wire bonding equipment consist of manual and automatic wire bonders.
1544.3 Manual Wire Bonders Manually operated wire bonders
1544.4 Automatic Wire Bonders Automatic wire bonders consist of two main types: ball bonders and wedge bonders.
1544.44 Automatic Ball Bonders Automatic ball bonders use ball bond to establish contact at the bonding pad and wedge bond to establish contact in the lead frame.
1544.441 Auto Ball Bonder - LED Auto Ball Bonder for LED
1544.442 Auto Ball Bonder - CIS Auto Ball Bonder for Image Sensor
1544.443 Auto Ball Bonder - Power & Discrete Auto Ball Bonder for Power and Discrete
1544.444 Auto Ball Bonder - Conv IC Auto Ball Bonder for leadframe or substrate
1544.445 Auto Ball Bonder - Advanced IC Auto Ball Bonder for SIP, thin die, stacked die
1544.45 Automatic Wedge Bonders Automatic wedge bonders use wedge bond to establish a contact in both pad and leadframe.
1544.451 Automatic Wedge Bonders - Power & Discrete Wedge Bonders for Power IC and Discrete IC
1544.452 Automatic Wedge Bonders - Battery Wedge Bonders for Battery
1545 Advanced Interconnect tools Area array bonding equipment are used in area array type interconnect devices.
1545.4 Flip Chip Equipment Flip Chip equipment are used specifically in flip chip process. These include F/C bonders underfill equipment and systems used in creating bumps in the wafer.
1545.43 Wafer Bumping Equipment Wafer bumping equipment are used to create the interconnect bumps in the wafer. These include screen printers, wire bonders, etc.
1545.44 Conventional Flip-Chip Bonders Flip Chip bonders are used to attach dies to substrate to create interconnect between die and substrate.
1545.441 > 15 Micron Accuracy Flip chip with greater than 15 Micron Accuraacy
1545.442 15 - 10 Micron Accuracy Flip chip with less than 15 Micron Accuraacy
1545.45 Advanced Die Placement Eqpt. High accuracy (<7 micron) die placement into advanced interconnect such as FiWLP, FoWLP, TSV and SIP. This includes die, F/C and TCB bonders
1545.451 Advanced Die Placement - Diebonder Die Placement Bonder for thin die
1545.452 Advanced Die Placement - F/C bonders Die Placement Bonder with Flipchip Capabilities during the bonding process
1545.453 Advanced Die Placement TCB Bonders Die Placement Bonder with Thermocompression Capabilities. It ultizes pressure and temperature duing the bonding process
1545.47 Underfill Equipment Underfill equipment are used to dispense material between chip and substrate after flip-chip attach. This material cures and provides enviromental protection between chip and substrate.
1545.49 Misc. Flip-Chip Equipment These systems are related to flip chip process but not included elsewhere. They are typically plasma cleaners, curing systems etc.
1545.9 BGA Ball Attach Equipment These systems are used to attach BGA balls to the substrate.
1546 TAB Tape Automated Bonding uses etched tape to make interconnect. Instead of using wire on a spool, the wiring is etched on a thin film. Conventional TAB involves applying high pressure and heat onto the die in order to bond all tape leads simultaneously
1549 Miscellaneous Bonders Miscellaneous bonders are interconnect bonders that are not included in any of the bonder categories.
1550 Packaging Equipment Packaging equipment market is made up of those equipment used to encase and label dies in their protective cases, protect the dies from environment as well as handle the final packaging of assembled dies.
1553 Molding & Sealing Systems Molding equipment places the die mounted to the leadframe in the mold, heats the plastic and infuses it into the mold. The plastic seals and encapsulates the die.
1553.3 Heaters, Ovens & Belt Furnaces Heaters, Ovens & Belt furnaces are used in the heat treatment process for sealing or curing the molding compound.
1553.4 Welders/Sealers Welders and sealers are use to place the cap on the package to create an enviromental seal.
1553.5 Presses Molding press transfers the leadframe to the mold, heats the plastic and infuses the plastic to the mold.
1553.6 Molds Die molds that are used in presses to mold the plastic over the dies.
1554 Lead Finishing & Marking Systems Systems that are used to finish the molded packages. These include lead finishing and package marking systems.
1554.3 Lead Trimming & Forming Lead trim-and-form systems are used to singulate die from leadframe and bend the leads to desired shape.
1554.5 Solder Plating Solder plating systems are used to coat package leads with solder. These systems are using two methods: electroplating or hot-dip tinning.
1554.6 Markers Markers are used to print identification code to the package.
1554.8 Misc. Finishing Misc. finishing equipment includes systems used in package finishing process and not classified anywhere else. These systems include dambar cutting and deflashers.
1555 Singulation Tools The systems use dicing or punching for final singulation of the finished package, such as QFN, BGA, CSP, etc.
1556 Transfer Tools Transfer tools are systems related to shipping and packaging finished packages. Typical systems are Tape and Reel equipment
1560 Integrated Assembly Systems Integrated assembly systems consist of automation hardware and software that enable integration between various packaging systems.
2004 Total Display Manufacturing Eqpt Revenue Total Display Manufacturing Equipment
2004.3 Total Display Mfg Service & Support Rev Total Display revenues from all sources of service, support, spares, upgrades and refurbishment derived solely from display and related capital equipment.
2004.4 Total Display System Sales Includes all manufacturing systems that are used to manufacture Flat Panel Displays (FPDs). The display types include LCD, PDP, OLED and other display types that use Lithography, Deposition, Etch and Cleaning systems to manufacture the panels.
2300 Display Test and Related Equipment Display equipment involved with test, burn-in. This typically includes ATE, probe systems, burn-in ovens, burn-in board loaders and unloaders, material handling.
2330 Display Automated Test System All equipment pertaining to the actual Display testing but excluding material handling systems.
2335 Display Linear and Discrete Test Systems Traditional Linear Display Test and Display Discrete Test.
2335.7 Display Traditional Linear Test Systems Traditional Linear Test systems covers all testers used for display testing
2335.8 Display Discrete Test Systems Discrete Test category contains testers for all active display discrete devices.
2337 Display Burn-in Systems Display Burn-in systems used for stress or reliabilty test
2338 Display Design Diagnostics Display diagnostics systems are used to diagnose the functionality of early designs when they are in first silicon.
2338.3 Display Circuit Probers Display probers are mainly E-beam based systems used for design diagnostics.
2340 Display Material Handling System Display material handling system serves as a interface between tester and display panel. This category includes Probers, Handlers and Laser Repair stations.
2343 Display Probing Equipment Display probers serve as a interface between tester and device when the device is still in panel form. The electrical contact is made through pins in probe card that contact the pads on the pannel.
2343.3 Display Automatic Probing Equipment Display automatic prober aligns pannel to the electrical probe points that make the contact to each cell, steps to the next cell, makes contact automatically.
2343.33 Display Semi-Automatic Probers Display semiautomatic prober is similar to fully automatic prober except that it has no facility to automatically loading and unloading from tray.
2343.34 Display Fully-Automatic Probers Display Fully automatic prober loads the panel from cassette, aligns it to the electrical probe points that make the contact to each cell, steps to the next cell, makes contact and then, when testing is through, returns the panel to the cassette.
2343.4 Display Manual Probers Display manual probers require manual loading and alignment of the panel as well as manual cell stepping.
2344 Display Handling Equipment Display a mechanical and electrical interface between the test system and the panel DUT.
2344.1 Display Gravity Feed Handlers A display level handler where the transport mechanism for the DUT is gravity.
2344.2 Display Pick & Place Handlers A display handler system where the transport mechanism fo the DUT is a robotic arm.
2344.8 Display Test in Strip L/F Handlers A display handler system used to move the DUT in strip or matrix leadframes and test in situ.
2344.9 Display Misc. Handlers by Feed Mechanism Miscellaneous display handlers that can not be categorized as gravity feed, pick and place or strip handlers.
2345 Display Laser Repair Station Display laser repair systems uses laser to modify the circuitry in the die by either cutting off defective memory cells or trimming predetermined resistors to fine tune device characteristics to the specs.
2345.4 Display Array Laser Repair System Display repair system cuts off defective cells and reconnect redundant cell to get high yields
2345.5 Display Cell Laser Repair System Display cell trim system can trim cell on wide variety of panel.
2400 Display Substrate Fabrication Equipment Display equipment that is used to manufacture cell on panel.
2430 Disp Microlithography & Mask Making Eqpt Display tools used to define the patterns on masks and transfer those patterns onto photoresist on the substrate surface. Includes resist processing equipment.
2433 Display Resist Coating Equipment Display equipment used for processing photoresist before and after exposure. Typical process modules include priming, coating, developing, curing, heating and cooling.
2434 Display Exposure Equipment Display equipment used to expose a photoresist on panel substrate
2434.3 Display Optical Exposure Equipment Display exposure equipment that use optics to project the image. These include aligners and steppers
2434.33 Display Contact / Proximity Aligners Display exposure equipment where the mask is in contact with or is in close proximity to the panel substrate.
2434.34 Display Scanning Projection Aligners Display exposure equipment where the light is focused through lenses to project the mask image onto the panel substrate. The light source and lenses scan across the stationary mask and panel substrate to ensure minimal loss of resolution.
2434.36 Display Stepping Aligners Display exposure equipment using lenses to project a miniaturized image of the mask onto the panel substrate. One mask can no longer expose the entire panel substrate so the same image is repeatedly moved and exposed until the whole panel substrate has been exposed.
2434.363 Display H/G line steppers Display lithography exposure tools using light sources at 405nm wavelength (H-line) or 436nm wavelength (G-Line)
2434.364 Display I line steppers Display lithography exposure tools using light sources at 365nm wavelength (I-line)
2434.45 Display Laser Beam Direct Expo Systems Display lithography exposure tool using energy from a laser beam to expose the photoresist material.
2435 Display Mask Exposure Equipment Display mask exposure equipment transfers a pattern of circuitry into a thin chrome layer on the glass mask. Mask exposure systems can be photoresist exposure systems or direct write systems. The mask making process closely follows the general wafer patterning process.
2435.3 Display Pattern Generation Equipment Display pattern generation equipment transfers the digital image of the pattern to the photoresist or directly removes the chrome layer from selected areas of the mask. A pattern generator consists of a light source and a series of motor- driven shutters. The chrome film deposited mask moves under the light source as the shutters allow exact shaped patterns of light to expose the photoresist.
2435.33 Display Optical Mask Exposure Equipment Display optical mask exposure systems use an ultraviolet light source for mask exposure. In principle, an optical mask exposure system is similar to the standard enlarger found in darkrooms. The system projects the image of a pattern through the absorber relief (photomask) and a projection lens to the substrate.
2435.34 Display E-Beam Mask Exposure Systems An electron beam mask exposure system allows direct mask exposure by using an electron beam as the energy source. The system consists of an electron source capable of producing a small diameter spot, and a beam control subsystem. The beam passes through electrostatic plates that direct the beam in an X-Y direction of the panel substrate, exposing the photoresist.
2435.35 Disp Focused Ion-Beam Mask Exposure Sys A focused ion beam (FIB) system generates a beam of positively charged ions and directs the beam to a specific site on the mask. The system consists of an ion source and ion focusing optics. The ion optics control movement of the beam. Positively charged ions contain almost all of the substance or mass associated with material objects. As a result ions interact strongly with the panel substrate. However, this is not as severe a problem in mask exposure as in panel exposure.
2435.36 Display Laser Beam Mask Exposure Systems A laser beam mask exposure system exposes the panel substrate with a laser beam. The mask blank is placed on an X-Y stage. The pattern file creates the driving signal for an acousto-optic modulator, which turns the exposure laser beam on and off. A lens in the fixed writing head focuses the beam onto the plate. The exposure beam is deflected in the Y direction as the stage is moved in the X-direction, creating an exposed scan strip of the pattern. This process is repeated until the plate surface is covered by adjacent scan-strips.
2450 Display Ion Implanters Display ion implanters directly inject impurity dopants into the silicon surface of a wafer. A gas containing the desired dopant is ionized. The ions are extracted from the source and are accelerated through an electric field. The dopant ions thus gain sufficient energy to penetrate the silicon surface and become embedded below the surface. Ion implanters are classified in 3 categories: low/medium current, high current, and high-energy (or high-voltage) systems.
2460 Display Deposition Equipment Display deposition is the process of laying down a thin film of material on the panel substrate surface. FPD manufacturing process use many of these films, sandwiched on a panel. These layers form the wires and insulators that ultimately interconnect all of the cells of the panel being produced. There are essentially three methods for depositing thin films. They are Chemical Vapor Deposition (CVD), Physical Vapor Deposition (PVD), and Epitaxy.
2463 Display Deposition Tools CVD tools for FPD
2463.3 Display CVD Tools Display deposition systems that use Chemical Vapor Deposition to deposit thin films to the substrate.
2463.33 Display PECVD Tools Display Plasma Enhanced CVD; Similar to Low Pressure deposition but add plasma to enhance the deposition process.
2463.35 Display MOCVD Tools Display Metal Organic CVD; Systems that use metal organic precursors to deposit the film.
2463.36 Display HTCVD Tools Display High Temperature CVD; System that deposit films above 750C degrees. The system may also contain capability for low pressure CVD but the process chamber can handle higher temperatures than typical LPCVD system. These systems are typically depositing epitaxial layers
2463.4 Display PVD Tools Display Platform based deposition systems that use physical vapor deposition to deposit thin films to the wafer. The films are conductive films.
2463.5 Display RTP Tools Display Rapid Thermal Processing; Systems that are capable of high temperature ramp rates by using lamps. In some cases hot plates or hot walls are used and wafers are moved into hot chamber to achieve high temperature ramps. Millisecond RTP systems are either laser or flash based Thermal processing tools. The advanced gate RTP tools combines RTP with plasma nitridation chamber.
2463.7 Display Diffusion/Furnace Display tube based diffusion and deposition systems
2463.8 Display Spin-On Deposition Tools Similar to display resist processing systems, spins liquids on the substrate to form the film.
2463.9 Display Electroplating Tools Uses electrolysis to deposit films.
2469 Deposition for Other (R&D and other applications) Miscellanious display deposition tools are not listed above.
2470 Display Etching & Cleaning Equipment Display Tools used for cleaning, stripping, etching and thinning of substrates
2473 Display Dry Processing Dry blanket or patterned etch of display substrates.
2473.4 Display Etch Tools Display Tools that create a plasma consisting of ions and neutral species that react with exposed portions of the substrate surface to remove dielectric, metal, or polysilicon material.
2473.49 Display Misc. Etch Etch tools for Display Manufacturing applications.
2473.5 Display Dry Stripping Tools Display dry processing tools that use plasma to remove photoresist, films or particles from substrate
2474 Display Wet Processing Display manufacturing Equipment making use of liquid surfactants for etching, stripping & cleaning to remove particles, contamination, or other materials from the substrate, mask, quartz products, and containers.
2474.3 Display Wet Processing Systems Display manufacturing Equipment making use of liquid surfactants for etching, stripping & cleaning to remove particles, contamination, or other materials from substrate.
2474.33 Display Wet by Configuration Display Wet wafer processing systems segmented by chamber configuration.
2474.339 Display Other Wet Processing Systems Display Other Single wafer wet processing systems except Spin & Spray. These include scrubbers, post-CMP cleaners, immersion, etc.
2474.4 Display Other Wet Processing Other wet wafer processing systems includes the systems not identified in other categories. These include manual wet wafer processing systems as well as all wet processing systems for display panels.
2480 Display Process Diagnostic Equipment Process diagnostics equipment monitor and verify consistent and controlled display manufacturing processes. These include equipment for display panel and substrate inspection, process monitoring and curve traces, as well as materials monitoring.
2483 Display Inspection Equipment Process diagnostics equipment that used for measuring and inspecting display panel.
2483.3 Display Measuring Instruments Film and substrate measuring instruments include non-electrical measurements of panel, surface and films.
2483.34 Display Film Thickness Instruments Display Instruments that are used to measure substrate thickness. These are ellipsometers, opto-acoustic and other instruments.
2483.343 Display Ellipsometers Display Ellipsometers measure transparent films.
2483.349 Display Other Film Thickness Instruments Other substrate thickness instruments include x-ray and optical measurement instruments.
2483.35 Display Flatness Instruments Display substrate flatness mapping instruments measure substrate flatness in the optical plane across the surface of the panel.
2483.36 Display Surface Profiling Instruments Surface profiling instruments measure the profile of panel surface.
2483.363 Display Tradtnl Surface Profiling Inst. Optical instruments that are used in surface profiling.
2483.37 Other Display Measuring Instruments Display substrate measuring instruments measure characteristics such as taper, warpage, and bow.
2483.4 Display Electrical Instruments DisplayElectrical instruments measure electrical characteristics of substrate or thin films. These systems include CV & DLTS plotters and misc electrical measuring tools
2483.5 Display CD Measuring Tools Display CD measuring tools are used the measure the critical dimensions of cell structures and lithography overlay accuracy.
2483.54 Display CD SEMs Display tools which use scanning electron microscopes, usually at low voltages (typically <2kV), to measure critical dimensions.
2483.6 Display Defect Inspection Tools Display defect inspection systems are used to detect, analyze and characterize defects.
2483.62 Display Brightfield Inspection Tools Display brightfield inspection systems use a focused beam of broadband or multiple-wavelength light to flood illuminate the substrate. The system collects the reflected light in a high-speed Time Delay Integration (TDI) sensor, where the image is digitized by a small area
2483.67 Display General Purpose Review Stations Display review stations use microscopes, SEMs or other methods to analyze defects or particle contamination.
2483.68 Display Other Inspection Other display inspection includes manual and operator-assisted inspection and review stations, as well as other inspection technologies.
2483.7 Display General Purpose Microscopy Tools This category includes HiV SEM, TEMs and other miscellaneous microscopy tools
2484 Display Reticle Insp & Repair Station Systems that are used to inspect or repair substrate and reticles
2484.4 Display Reticle Inspection Systems All systems and microscopes that are used to inspect display substrates and masks.
2484.5 Display Reticle Repair Station Systems that are used to repair defective display substrates and masks.
2485 Display Process & Curve Tracers To be defined. Meanwhile, please refer to the Equipment Models codes by this VIC code to obtain comparable models
2485.3 Automatic Process Monitors To be defined. Meanwhile, please refer to the Equipment Models codes by this VIC code to obtain comparable models
2490 Display Other Fabrication Equipment Other display manufacturing or processing equipment. They include display manufacturing and automation
2493 Display Machining Equipment The systems that are used to manufacture substrate for display panel
2494 Display Automated Handling Systems Systems that are associated with transporting and storing panel and substrate in the fab.
2494.6 Display Handling Systems Systems that store, transport and transfer substrate in the fab.
2494.62 Display Transport Systems Systems that transport substrate from bay to bay and within the bay.
2494.621 Display Overhead Transport Systems Overhead rail system to transport substrate
2494.629 Display AGVs AGVs and other substrate transport systems.
2494.63 Display Transfer Systems Display sorters and other stand alone display transfer systems.
2494.64 Display Stockers Systems that is used to store and retrieve correct panel for processing
2500 Display Assembly Equipment Display assembly equipment are chip making systems that are used to package the finished display substrate into separate panel. These systems inspection, dicing, bonding, and packaging systems and associated inspection and marking systems.
2520 Display Inspection Equipment Display assembly inspection systems are used to inspect substrate or panel for defects. This segment is divided into die inspection, bonding inspection, package inspection and other inspection categories.
2524 Display Bonding Inspection Equipment Display bonding inspection equipment are used to inspect the quality of interconnect bond and wires. These systems typically are X-ray based that can image the complete panel or simple bond pull strength testers.
2529 Display Other Assy Inspection The systems are used for other display panel.
2530 Display Dicing Equipment The market for display dicing equipment consists of three segments: sawing equipment, scribing equipment and dicing accessories. These systems are used to cut the panel in to separate substrate, thinning the panel and holding the cut panel intact until the panels are bond
2533 Display Sawing Equipment Display sawing equipment are diamond blade saws that are used to cut the panel apart
2534 Display Scribing Equipment These systems use either a diamond-tipped scribe or a laser to scribe the surface of the wafer between the substrate. When tapped or rolled, using breaking equipment, the panel will then break cleanly along the scribe lines.
2535.3 Display Breaking Equipment Display breaking equipment are used to break the substrate along scribe lines to separate the substrate after scribing. Additionally, breaking equipment are used in panel separation when panels are not sawn through.
2535.4 Display Mounting Equipment These equipment mount both the film and panel to the frame that are used to keep the panel and saw substrate in place during the dicing operation.
2540 Display Bonding Equipment Display bonding equipment consists of die bonding equipment, Wire bonders, TAB bonders and advanced interconnect equipment. These equipment are used to attach the die to leadframe or substrate and create interconnect between the die and lead frame or substrate
2543 Display Automatic PCB Bonders Automatic wire bonders consist of two main types: ball bonders and wedge bonders.
2544 Display Interconnect Bonding Display Interconnect bonders consist of wire bonders and Tape Automated Bonders that create interconnect between die and leadframe.
2544 Display Wire Bonding Equipment Display wire bonders create interconnect between substrate pads and leadframes using wire. Wire bonding equipment consist of manual and automatic wire bonders.
2544.4 Display Automatic Wire Bonders Manually operated wire bonders
2544.44 Display Automatic Ball Bonders Display automatic wire bonders consist of two main types: ball bonders and wedge bonders.
2544.45 Display Wedge Bonders Automatic ball bonders use ball bond to establish contact at the bonding pad and wedge bond to establish contact in the lead frame.
2545 Disp. Area Array Bonding Equipment Display area array bonding equipment are used in area array type interconnect devices.
2545.4 Disp. Flip Chip Equipment Display Flip Chip equipment are used specifically in flip chip process. These include F/C bonders underfill equipment and systems used in creating bumps in the display panel.
2545.44 Disp. Flip-Chip Bonders Display Flip Chip bonders are used to attach cell to substrate to create interconnect between cell and substrate.
2545.45 Disp. Underfill Equipment Display underfill equipment are used to dispense material between chip and substrate after flip-chip attach. This material cures and provides enviromental protection between chip and substrate.
2545.49 Disp Misc. Area Array Eqpt. These systems are related to flip chip process but not included elsewhere. They are typically plasma cleaners, curing systems etc.
2546 Display TAB Display Tape Automated Bonding uses etched tape to make interconnect. Instead of using wire on a spool, the wiring is etched on a thin film. Conventional TAB involves applying high pressure and heat onto the die in order to bond all tape leads simultaneously
2550 Display Packaging Equipment Display packaging equipment market is made up of those equipment used to encase and label substrate in their protective cases, protect the substrate from environment as well as handle the final packaging of assembled panel.
2553 Display Molding & Sealing Systems Display molding equipment places the die mounted to the leadframe in the mold, heats the plastic and infuses it into the mold. The plastic seals and encapsulates the substrate. During the sealing process, the substrate is bonded to the panel and a 'cap' is sealed onto
2554 Disp. Lead Finishing & Marking Systems Display systems that are used to finish the molded packages. These include lead finishing and package marking systems.
2554.6 Display Markers Display markers are used to print identification code to the panel.
2554.8 Display Misc. Finishing Display Misc. finishing equipment includes systems used in package finishing process and not classified anywhere else. These systems include dambar cutting and deflashers.
2660 Display EDA Tools FPD Software related Electronic Design Automation
2665 Display Prod. Management Software FPD Software that is used for fab production Management in . This includes scheduling, WIP tracking, material control etc.
2665.3 Display MES S/W FPD Manufacturing execution system software
2665.5 Display Equipment Engineering S/W FPD Software that is used to monitor, maintain and adjust equipment operational performance
2667 Display Process Control Systems FPD Systems that use process diagnostics or equipment performance data to feed forward or backward process control in the fab.
2667.3 Display Process Diagnostics S/W FPD Software that specifically uses equipment related process parameter data to control process.
2667.5 Display Mfg and Yield Solutions FPD Manufacturing and yield solutions that are a compilation of analytic simulations.
 
 
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