MILPITAS, Calif. — June 22, 2021 — Semiconductor manufacturers worldwide will have started construction on 19 new high-volume fabs by the end of this year and break ground on another 10 in 2022 to meet accelerating demand for chips across a wide range of markets including communications, computing, healthcare, online services and automotive, SEMI highlighted today in its quarterly World Fab Forecast report. Equipment spending for the 29 fabs is expected to surpass $140 billion over the next few years.
China and Taiwan will lead the way in the new fab construction starts with eight each, followed by th
China and Taiwan will lead the way in the new fab construction starts with eight each, followed by the Americas with six, Europe/Mideast with three, Japan and Korea with two each (Figure 1). Fabs that produce 300mm wafers will account for most of the new facilities – 15 – in 2021 and again in 2022, when seven fabs will begin construction. The remaining seven fabs planned over the two-year period will be 100mm, 150mm and 200mm facilities. The 29 fabs could produce as many as 2.6 million wafers per month (in 200mm equivalents).
Figure 1: Projected fab construction starts
Projected Fabs by Sector and Technology
Of the 29 fabs starting construction in 2021 and 2022, 15 are foundry facilities with capacities ranging from 30,000 to 220,000 wafers per month (200mm equivalents). The memory sector will begin construction on four fabs over the two-year span. Those facilities will boast higher capacities ranging from 100,000 to 400,000 wafers per month (200mm equivalents).
Of the semiconductor makers beginning construction of new fabs this year, many won’t start installing equipment until 2023 since it takes up to two years after ground is broken to reach that phase, though some could begin equipping as soon as the first half of next year.
While the World Fab Forecast shows 10 high-volume fabs starting construction next year, that number is likely to climb as chipmakers announce new facilities. The report tracks investments for fab construction and fab equipment, in addition to capacities, products and technologies from 2021 through 2022.
In addition to the 29 high-volume fabs, the World Fab Forecast report tracks 22 low-probability projects that could begin construction in 2021. Work on another 15 low-probability projects could start the following year.
SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Technology Communities, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.
Christian G. Dieseldorff/SEMI