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    Power Electronics Overview: What are the markets and trends?

      Yole Développement
     10th-Oct-2018
    Description: Power module with baseplate is the standard design (70 to 80% of available power modules). DBC (Direct Bond Copper) packaging is the most widespread packaging. These modules are complex and expensive.
    Important Tags: tag test erer
    Views: 1774
    Domain: Electronics
    Category: Semiconductors
    Contents:
    From Technologies to Market

    Power
    Electronics
    Overview:
    What are the
    markets and
    trends?

    © 2015
    © 2015

    Power Electronics and
    st century challenges
    21

    POWER ELECTRONICS AND 21ST CENTURY CHALLENGES
    World Evolution lead to new challenges for power electronics
    Population
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    Mega
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    Energy
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    Renewable
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    Limited
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    Transportation
    needs

    Efficiency
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