BERLIN, Germany – 17 February, 2021 – Qurv and Infineon Technologies have won the MEMS & Imaging Sensors Technology Showcase at the Technology Unites Global Summit, SEMI announced today. The Qurv wide-spectrum image sensor was recognized as the best imaging technology and the Infineon Technologies environmental sensor as the leading MEMS technology. The winners were selected from five finalists in each category in a vote by a committee of industry experts.
“Image and MEMS sensors advances are delivering tremendous societal and economic benefits, making our lives safer and healthier and the air cleaner,” said Laith Altimime, president of SEMI Europe. “The Qurv and Infineon Technologies innovations epitomize electronics industry innovation.”
The Technology Showcase honors standout applications enabled by MEMS and image sensors technology. The awards were presented by Dr. Martina Vogel of Fraunhofer ENAS.
Technology Showcase Winners
Qurv – Enabling a World of Enhanced Vision
Qurv developed wide spectrum image sensors that capture information hidden by ambient light interference or information not available in the visible light spectrum for next-gen computer vision applications. Qurv's technology leverages current CMOS scalable manufacturing and advanced materials to unlock new levels of performance, reliability and function. All Qurv image sensors are designed with AI and machine perception in mind. The technology was presented by Stijn Goossens, Co-founder and CTO of Qurv.
Infineon Technologies – XENSIV™ PAS CO2 Sensor, a new Environmental Sensor Technology. Photoacoustic Spectroscopy (PAS) Miniaturizes CO2 Sensors for High-volume Applications
Leveraging its advanced MEMS microphone technology, Infineon Technologies developed a disruptive CO2 sensor based on photoacoustic spectroscopy (PAS). Exceptionally miniaturized, the sensor is designed to accommodate high-volume manufacturing. The first CO2 sensor with SMD capabilities, the innovation will enable widespread adoption of air quality monitoring in high-volume applications in a variety of markets such as industrial, medical and Internet of Things (IoT). The platform was presented by Andreas Kopetz, Senior Director of Environmental Sensing at Infineon Technologies.
The Technology Showcase demonstrations are available for on-demand viewing. The awards, organized by SEMI, are offered each year for companies across a range of sectors from IoT and consumer electronics to robotics and biomedical equipment. Winners receive a free exhibition booth at SEMI MEMS & Imaging Sensors Summit.
Technology Showcase Finalists
- Enabling a World of Enhanced Vision, Stijn Goossens, Qurv
- Analyze-first Architecture for Ultra-low-power Always-on Sensing, Tom D., Aspinity, Inc.
- Novel Platform to Solve 3D Nanometry Challenge, Mikko Utriainen, Chipmetrics Oy
- All-silicon Ultrasonic Recognition of the Environment, Bert Kaiser, Fraunhofer IPMS
- XENSIV™ PAS CO2 Sensor, Andreas Kopetz, Infineon Technologies
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SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.
Serena Brischetto/SEMI Europe
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