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    Sixth Gen IGBT Module

      Mitsubishi Electric Corporation
     Nov 29, 2010

    6th Generation FWDi chip, 6th Generation IGBT chip, NX-Series Package Design, Line-up and Development, Optimizing PCM, Turn off Waveform of IGBT, Gate Capacitance, Forward Voltage Characteristic, RBSOA, Short Circuit Capability, dv/dt Controllability, Inverter Loss Comparison, Package of NX Series, Thermal Impedance Comparison, Package Compatibility.

    Important Tags: FWDi chip, IGBT chip, NX-series package design, Optimizing PCM
    Views: 3688
    Domain: Electronics
    Category: Semiconductors

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