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    Standardization Of Packaging For The Internet Of Things

      Adrian Arcedera
     Dec 28, 2015
    Description:

    General IoT Packaging Requirements: Low cost, Low power, RF requirements (shielding), Scalable to high volume manufacturing, Small package size, Stimulus delivery. The Packaging Challenge – Stimulus Delivery: No standard process (CMOS, BiCMOS...), No p-n junction for MEMS, And as a consequence, NO ROADMAP. Integration is happening at the front-end to complete the building blocks of IoT, Standard IoT platforms = faster development: Faster introduction of new products, IoT monetization.

    Important Tags: Internet of Things, Power Management, IoT Packaging, IoT Packaging Challenges, Packaging Technologies, MEMS/Sensor Packaging, IoT Blocks
    Views: 1623
    Domain: Electronics
    Category: Semiconductors


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