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    Technology Trends and Future History of Semiconductor Packaging Substrate Material

      Yoshihiro Nakamura, Shigeki Katogi
     Aug 15, 2016
    Description:

    The electronics industry has developed dramatically over the past half-centur y, primarily thanks to the semiconductor industry. Today, with increasing demand for smartphones and tablet computers, further high-volume, high speed, low power consumption LSIs and smaller/thinner semiconductor packages are strongly required. Meanwhile, the technical challenges involved in further fine pitch design shift the focus to assembly technology, which is considered the core technology required to achieve high-volume, high-integration semiconductor packages.

    Important Tags: Electronics Industry, Semiconductor Packaging, Package on Package, Electronics Technologies, Silicon Chips
    Views: 1518
    Domain: Electronics
    Category: Semiconductors


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