Technoprobe S.p.A., Feinmetall GmbH and FormFactor, Inc. Concluded a Settlement of a Patent Dispute

      VLSI's Select Industry News
      11th-Jun-2020    339   

    Feinmetall GmbH,Technoprobe S.p.A., and FormFactor, Inc. have settled a patent dispute regarding the US Patent 7,850,460 in the U.S. District Court for the District of Delaware (Case No. 1:18-cv-01057-RGA). US Patent 7,850,460 owned by Feinmetall covers a lamella probe technology for testing solutions in the semiconductor industry. This dispute has been settled by the parties on the basis of a license to the Patent and its 15 international counterparts.

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    Domain: Electronics
    Category: Semiconductors