OSAT: Why Advanced Packaging is flipping the Off in OSAT to On-Shore Assembly & Test.

    The Chip Insider®
    September 11, 2020 — Strategy and Tactics: OSAT: Why Advanced Packaging is flipping the Off in OSAT to On-Shore Assembly & Test. CHC: Going Off-Shore. WildPhotons: When everything is going against you ...
    G. Dan Hutcheson G. Dan Hutcheson
    Summaries:
    OSAT: Why Advanced Packaging is flipping the Off in OSAT to On-Shore Assembly & Test. It is hard to deny there is a strong reverse integration of packaging into companies that own their own fabs. Here are the structural reasons why Advanced Packaging is evolving from an OffSAT to an OnSAT world where Assembly and Test are close to design and fab with a More-than-Scaling strategy as a cornerstone of the post-More Moore world. We look at how IBM wrote the playbook on this strategy and why TSMC, Intel, SkyWater, and GLOBALFOUNDRIES are taking it to a new level.

    Tower hit with Cyber hack: This is the second foundry to be hacked, including X-Fab, in as many months. It certainly points to a need to have IT security on high alert. I look at IT security strategy for selecting a foundry.

    Are the Trump Administration's actions against China affecting US Semiconductor Equipment Stock Performance? This was an interesting allegation by a stock analyst this week that had me wondering if it was true. So I dug into VLSIresearch's indices to see if it was true. Here you can see a breakout of our semiconductor equipment stock index into U.S. versus non-U.S. stocks through last Friday. Make your own judgments, but what I see is non-U.S. equipment stocks peaked in early July and slumped while U.S. stocks were still rising. Then when the U.S. peaked in late July, the others followed. Moreover, Semiconductor stocks struggled to make gains over the same period. This was all happening while the S&P 500 continued to grow until last week. If anything, semiconductor equipment was predicting the market's drop. I also index EU and Japanese stocks to see if they are performing better.

    The Chip History Center: - Going Off-Shore: An Interview with Charlie Sporck about how it all happened.

    OSAT: Why Advanced Packaging is flipping the Off in OSAT to On-Shore Assembly & Test.


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