The Chip Insider® Semiconductor Equipment Weather Report: June 8, 2020

    The Chip Insider®
    Semiconductor Equipment Weather Report: June 8, 2020
    Cautiously moving forward
    • Order activity for semiconductor equipment continued to move higher, jumping past 75 degrees
    • The rate of increase slowed from the previous week amid shifting sentiment within segments
    • SOC Mobile cooled off by a couple of points due to growing uncertainties from the new U.S. sanctions on Huawei
    • However, Memory offset the weakness in Mobile, jumping by more than two points on the back of improving market fundamentals
    • Subcon/Adv. Packaging continued to surge, recorded the biggest gain among segments, and hit a fresh new high for the year
    • VLSI's Chip Price Performance Index (CPPI) ) is pulling out of the dive
      • DRAM declined
      • NAND flat
      • MPUs rose
    • Electronics OEM inventories are trending higher

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