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    Wafer Level Packaging Mainstream

      Michael Töpper PhD
     Dec 14, 2016
    Description:

    Introduction-Development of Single Chip Packaging:- Example of WLP at IZM: Automotive Application: Chip Scale package integration of different microsystem technologies by thin die stacking, polymer embedding and redistribution/bumping for automotive applications. Reliability prediction is key (thermomechanical simulation) (Department:Environmental and Reliability Engineering). Wafer Level Packaging:Mainstream for mobile products.

    Important Tags: Wafer Level Packaging, Wafer Level, Thermomechanical, Chip Packaging, 3D Integration
    Views: 2135
    Domain: Electronics
    Category: Semiconductors


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